2uul BH40 Middle Layer BGA Reballing Stencil Platform Set for iPhone 17 Series
2uul BH40 Middle Layer BGA Reballing Stencil Platform Set for iPhone 17 Series
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Description
2. Integrated magnetic structure securely holds chips and stencil in place, preventing displacement during heating and reflow.
3. Comes with matched stencil support for fast alignment and uniform solder ball planting, significantly improving workflow efficiency.
4. Manufactured with premium-grade materials and precision machining, offering excellent durability, heat resistance, and long service life.
5. Compact and lightweight design (about 44g) allows for precise operation and easy handling in high-frequency repair tasks.
6. Package includes:
1 x Positioning Plate
4 x Stencil
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